3D soldering paste measurement improves printing process.

3D SPI-System

abatec continually invests at its two company locations (Regau/Upper Austria and Mariapfarr/Salzburg) in the hightech machinery and the further education of its employees. The newest investment was the purchase of two KohYoung 3D SPI systems for the abatec SMT assembly line.

By the use of these new systems, abatec expects a considerable optimization of the printing process. The extensive SPC Plus tool enables the interpretation of all relevant measured data in real time, which gives abatec the opportunity to immediately take corrective actions if inaccuracies occur in soldering paste printing and to improve the whole process.


Back to news